COB Light Source Manufacturing Process

- Mar 29, 2018 -

The COB light source is a high-efficiency integrated surface light source technology that directly attaches the LED chip on the high-reflectance mirror metal substrate. This technology eliminates the concept of the bracket, electroless plating, no reflow, and no patch process, so the process is reduced by nearly three points. One, the cost is also saved by one third.

The COB chip-on-board process first covers the surface of the substrate with a thermally-conductive epoxy resin (usually silver-doped epoxy) to cover the silicon deposition sites. The silicon wafer is then placed directly on the substrate surface and heat-treated until the silicon wafer is firmly fixed. After the substrate, the electrical connection between the silicon wafer and the substrate is then established directly by wire bonding.

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